Rheological, Physical Properties and Sensory Evaluation of Biscuits Enriched with Chia Seed Powder

Hassan, Heba; Elgharably, Alia; Ashoush, I.S; Abd-El-Khalek2, Mokhtar; Salem, Safaa

doi:10.21608/enj.2023.311121

Rheological, Physical Properties and Sensory Evaluation of Biscuits Enriched with Chia Seed Powder

Document Type : Original Article

Authors

10.21608/enj.2023.311121

Abstract

ABSTRACT
Biscuits enriched with Chia seed powder (CSP) are a kind of nutritional and functional bakery product. The aim of this research is to evaluate the supplement of wheat flour by chia seed powder at different levels (5, 7, 10 and 15%) in the manufacture of biscuit. The antioxidant capacity, phenolic compounds, physical analysis, texture, rheological properties (farinography, extensography tests) and sensory evaluation of the dough samples were evaluated. The results showed that chia seed powder had a potential antioxidant capacity because it contains phenolic compounds. Withregard to farinography and extensography tests, it was observed that increasing the level of substitution with chia seed powder, the time to reach the maximum consistency of the dough reduced. Also the extensibility of the dough decreased significantly, which represents the possibility of using chia seed powder in biscuits with replacement level up to 15% without any negative effect on the rheological properties of the dough. Determining the physical properties of biscuit samples showed a decrease in biscuit size, and the results of the texture profile analysis showed an increase in hardness and cohesiveness by adding chia seed powder. Overall acceptance of biscuits did not differ significantly up to the 7% substitution level, Therefore, nutritional and functional improvement of products using chia is a very promising concept, and recommended to use chia seed powder in the production of biscuits and other baking products for contains to its antioxidants and other nutrients.

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